High Density Interconnect PCB Market Share, Analysis, Trend, Size, Growth till 2027

 Market Highlights

The high-density interconnect PCB market is likely to inflate from USD 8,683.9 million in 2018 to USD 15,600.6 million by 2023. The market is evolving at a CAGR of 12.4% during the forecast period, 2020–2013.

Overview

High density interconnect PCB is considered to have a higher circuitry density than a traditional PCB. It allows the designers to place more components on high density interconnect PCB. These help in reducing signal loss and crossing delays by creating a shorter distance between the electronic components and the small size of the components. Thus, it results in the faster transmission of signals from one part to another.

Market Driver & Trends

The global High Density Interconnect PCB Market Size is witnessing a substantial growth owing to the factors such as escalating demand for smaller, energy-efficient, and high-performance PCBs. These factors have helped the overall electronics industry to produce smarter, lighter, faster, and smaller PCBs that have been witnessing rising demand lately and contributed to the market growth remarkably.

In case of point, in the last two decades, the cellular mobile phone market has practiced marvelous innovation, from the simple monochromic display and necessary voice call capability to feature-rich computing device with the high-resolution feature in touch screen, camera, fast internet connectivity, GPS, music player, and more. On the other side, massive desktop computers during the 1990s are advanced to faster and smaller laptops with the help of HDI PCBs. These significant developments with mounting demand are estimated to drive the market growth constructively.

The consumer electronics industry vertical is the most significant contributor in the high-performance PCB market owing to the wide adoption of HDI PCBs and revolutionizing the competitive landscape of the market and is anticipated to continue so in the review period. On the flip side, the factor of high cost allied with manufacturing and lack of expertise in manufacturing could hamper the market growth during the forecast period.

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Segmentation:

The high-performance PCB market globally has been segmented into a number of high-density interconnection layer and industry vertical.

In terms of a number of high-density interconnection layer: It includes 1, 2, and all.

In terms of industry vertical: It includes consumer electronics, military and defense, telecom and IT, automotive, manufacturing, medical devices, and many more.

Regional Analysis:

The regional analysis of the global high-performance PCB market covers regions such North America, Europe, Asia-Pacific, and rest of the world.

North America has been observed to be leading the high-performance PCB market during the forecast period and is considered as the most highly developed region is concerned with the development and adoption of innovative technologies in semiconductors. The region also has considerable potential for generating high revenue in the market, particularly from the automotive and consumer electronics industry verticals. The U.S. has expected to be the leading country in the high-performance PCB market in the North America region during the forecast period.

Asia-Pacific is predicted to develop at the fastest rate during the forecast period owing with the availability of low-cost technologies, and the existence of many electronic devices manufacturing firms in the region are some of the motivating factors for the high-performance PCB market in this region. Prime countries like China, Japan, and India have been the leading countries in the Asia-Pacific region in terms of market share and has been trending is anticipated to continue in the forthcoming years.

Competitive Dashboard:

The well-known players in high-performance PCB market are listed as Epec, LLC (US), TTM Technologies (US), PCBCART (China), Millennium Circuits Limited (US), RAYMING (China), Mistral Solutions Pvt. Ltd. (India), SIERRA CIRCUITS, INC. (US), Advanced Circuits (US), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), FINELINE Ltd. (Israel), and Austria Technologie & Systemtechnik Aktiengesellschaft (Austria).

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About Market Research Future:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

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