Chip Scale Package LED Market Company Profiles, Market Segments, Landscape 2027

 Market Analysis

Market Research Future (MRFR) estimates the global chip scale package LED market size to hit USD 1,807.5 million at a CAGR of 19.4% from 2018–2023 (forecast period).

Multiple Factors to Augment Market Growth

Chip scale package LED is a step forward from standard LEDs in which the packaging process involves attaching a die to an interposer (ceramic substrate), resulting in a packaged LED. The packing operations are avoided in the fabrication of a chip scale package LED because the chip is singulated and coated with phosphor. After the wafer has been diced, a chip scale package LED is ready for use on a PCB. Because several manufacturing procedures are eliminated, the manufacturing cost of a chip size LED is substantially lower than that of a regular LED. This also decreases the possibility of producing substandard products.

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The Global Chip Scale Package LED Market is primarily driven by low manufacturing costs and high package density. The product is projected to be widely adopted in the automotive industry. Applications in general lighting are another key possibility for the chip size package LED market to grow at a rapid pace in the next years. The market is hampered by the limited applications of chip scale package LEDs. Because of its high demand for electronic devices such as TVs, computers, and other display systems, the backlighting unit (BLU) is likely to dominate the market in terms of market size throughout the forecast period.

Market Segmentation

The global chip scale package (CSP) LED market has been segmented into application and power range.

By application, the global chip scale package (CSP) LED market has been segmented into backlighting unit (BLU), general lighting, automotive lighting, flash lighting, and others.

By power range, the global chip scale package (CSP) LED market has been segmented into high power and low- and mid-power.

Regional Analysis

APAC to Rule the Global Market

During the projected period, Asia Pacific is expected to lead the chip scale package LED market. The Asia Pacific region is regarded as the most promising in terms of the development and deployment of chip scale package LEDs in smartphone and display systems. The region has enormous revenue creation potential in the Chip Scale Package (CSP) LED Market, notably from consumer electronics sector verticals. During the projected period, China is expected to be the dominant country in the Asia Pacific Chip scale package LED market.

Key Players

The prominent players in the chip scale package LED market are Lumileds Holding B.V. (US), Samsung Electronics Co., Ltd. (South Korea), Semiconductor Co., Ltd. (South Korea), OSRAM Opto Semiconductors GmbH (Germany), LG Innotek (South Korea), Epistar Corp. (Taiwan), Cree, Inc. (US), Genesis Photonics Inc. (Taiwan), Semileds Corporation (Taiwan), and Lextar Electronics Corporation (Taiwan).

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About Market Research Future:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

MRFR team have supreme objective to provide the optimum quality market research and intelligence services to our clients. Our market research studies by products, services, technologies, applications, end users, and market players for global, regional, and country level market segments, enable our clients to see more, know more, and do more, which help to answer all their most important questions.

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